The Company was incorporated with name of “Taiwan Aichi Steel Corporation” and paid-in capital of NT$ 3,610,000.

The Company was engaged in the manufacturing, processing and external sales of “thermal break riser insulation board” and “thermal break riser surface insulation board”.

The Company handled capital increase in cash of NT$ 17,178,000 and the paid-in capital reached NT$ 20,338,000 after capital increase.

The Company handled capital increase in cash of NT$ 4,350,100 and the paid-in capital reached NT$ 24,688,100 after capital increase.

Aichi Steel Corporation, a Japanese enterprise, transferred its shared held in the Company to SUMITOMO METAL MINING ASIA PACIFIC PTE LTD (hereinafter referred to as SMMAP), a Singaporean enterprise, and changed the name of the Company to “SUMICO ELECTRONICS TAIWAN CO., LTD.”.

The Company handled the loss compensation by capital decrease of NT$ 17,900,100, and also handled capital increase in cash of NT$ 59,212,000. The paid-in capital of the Company after capital decrease and increase reached NT$ 66,000,000, and SMMPA held 70% of company shares.

Business items were changed to the manufacturing, processing and trading of wire frames used for integrated circuits and transistors.

The Company began the manufacturing, processing, trading and import and export business of wire frames used for integrated circuits and transistors.

The Company handled capital increase in cash of NT$ 66,000,000 and the paid-in capital after capital increase reached NT$ 132,000,000.

The Company passed QS-9000 certification.

The Company handled capital increase in cash of NT$ 200,000,000 and the paid-in capital after capital increase reached NT$ 332,000,000.

The Company handled capital increase in cash of NT$ 168,000,000 and the paid-in capital after capital increase reached NT$ 500,000,000.

The Company passed ISO-14001 certification.

The Company conducted merger of “Taiwan SUMICO Precision Molds Co., Ltd.” by absorption and it was an eliminated company. 6,250,000 shares were reissued through absorption and the paid-in capital after absorption reached NT$ 562,500,000.

The Company passed ISO-9001 certification.

The Company handled capital increase by earnings of NT$ 1,000,000. The paid-in capital after capital increase reached NT$ 563,500,000.

The Company developed Tape-COF using subtractive method (also known as etching method).

The Company established the second factory to produce Tape-COF.

The Company handled capital increase in cash of NT$ 546,500,000 and the paid-in capital after capital increase reached NT$ 1,110,000,000.

The clients began the certification of Tape-COF product and volume production started.

The second factory of the Company passed OHSAS-18000 certification.

The Company introduced semi-additive (also known as plating) technology to produce Tape-COF.

The Company passed TS-16946 certification.

The Company became the only company with volume production using semi-additive process in the world.

The Company stopped producing Tape-COF using subtractive method and presented impairment loss of NT$ 906,277,000 (including fixed assets of NT$ 883,193,000 and asset leasing of NT$ 23,084,000).

The Company handled capital decrease of NT$ 4000,000,000 on April 1 and split and transferred the wire frame part to “Taiwan SUMICO Technologies Co., Ltd.” in form of brother separation. The paid-in capital after capital decrease reached NT$ 710,000,000.

In June, SMMAP transferred 70% of equity held in the Company to SUMIKO TAPE MATERIALS SINGAPORE PTE. LTD. (hereinafter referred to as STM).

Chang Wah Electromaterials Inc., the second largest shareholder of the Company, acquired all equity held by STM in the Company at the end of March with shareholding ratio of 100%, and it was also renamed as “JMC Electronics Co., Ltd.”.

In order to strengthen the operating system of the Company, Chipmos Technologies Inc., a semiconductor enclosed test factory, was introduced for strategic investment and it became the second largest shareholder of the Company.

The Company handled loss compensation by capital decrease of NT$ 410,000,000. The paid-in capital after capital decrease reached NT$ 300,000,000.

The Company handled capital increase in cash of NT$ 400,000,000 and the paid-in capital after capital increase reached NT$ 700,000,000.

The Company handled capital increase in cash of NT$ 200,000,000 and the paid-in capital after capital increase reached NT$ 900,000,000.

In January, the Company resumed the production of the stopped subtractive process production line and recognized and reversed impairment loss to income of NT$ 121,939,000.

The Company stock was approved for public listing in August.

The Company stock was registered in TPEx for listing in September.

The Company handled capital increase in cash of NT$ 100,000,000 before initial listing. The paid-in capital after capital increase reached NT$ 1,000,000,000.

The Company stocked was listed in Taiwan Stock Exchange for trading in January.

In the second half of this year, the demand for driver IC used for smartphone from COG to COF was increased gradually month by month.

In April, Chipmos Technologies Inc. was no longer a major shareholder holding more than 10% of shares in the Company.

The Company handled loss compensation by capital decrease of NT$ 170,000,000. The paid-in capital after capital decrease reached NT$ 830,000,000.

The Company issued convertible corporate bond of NT$ 500,000,000.