The company manufactures tape-based flexible IC substrates (COF tape) required for LCD panel driver ICs, which are divided into two types of COF processing technologies: the semi-additive method and the subtractive method.

LCD driver IC packaging requires high-density bonding technology, and depending on the packaging structure used, it can be classified into: TCP (Tape Carrier Package) three-layer tape-based advanced flip-chip film IC substrate packaging, COF (Chip on Film) two-layer tape-based advanced flip-chip film IC substrate flip-chip packaging, and COG (Chip on Glass) glass flip-chip packaging. Among them, the TCP process is similar to COF, but the crystals and pins it carries are suspended, making it unsuitable for bending, as there is a risk of pins breakage. The pins of COF are directly bonded to the tape, and the chip forms an eutectic bond with the tape. COF's tape is thinner and more flexible, allowing greater processing flexibility. COG involves directly soldering the product onto the LCD panel, which can save costs associated with the product's material tape.